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Thermoplastic Cellulose-Based Compound for Additive Manufacturing.
Immonen K, Willberg-Keyriläinen P, Ropponen J, Nurmela A, Metsä-Kortelainen S, Kaukoniemi OV, Kangas H. Immonen K, et al. Molecules. 2021 Mar 18;26(6):1701. doi: 10.3390/molecules26061701. Molecules. 2021. PMID: 33803734 Free PMC article.
Suitability of Paper-Based Substrates for Printed Electronics.
Jansson E, Lyytikäinen J, Tanninen P, Eiroma K, Leminen V, Immonen K, Hakola L. Jansson E, et al. Among authors: immonen k. Materials (Basel). 2022 Jan 26;15(3):957. doi: 10.3390/ma15030957. Materials (Basel). 2022. PMID: 35160899 Free PMC article.
Bio-Based Polymeric Substrates for Printed Hybrid Electronics.
Luoma E, Välimäki M, Ollila J, Heikkinen K, Immonen K. Luoma E, et al. Among authors: immonen k. Polymers (Basel). 2022 May 2;14(9):1863. doi: 10.3390/polym14091863. Polymers (Basel). 2022. PMID: 35567032 Free PMC article.
Potential of Commercial Wood-Based Materials as PCB Substrate.
Immonen K, Lyytikäinen J, Keränen J, Eiroma K, Suhonen M, Vikman M, Leminen V, Välimäki M, Hakola L. Immonen K, et al. Materials (Basel). 2022 Apr 5;15(7):2679. doi: 10.3390/ma15072679. Materials (Basel). 2022. PMID: 35408011 Free PMC article.