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Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum.
Materials (Basel). 2022 Aug 1;15(15):5301. doi: 10.3390/ma15155301.
Materials (Basel). 2022.
PMID: 35955233
Free PMC article.
Characterization of Sn-Sb-Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu-SiC Metal-Ceramic Composite.
Kolenak R, Kostolny I, Drapala J, Babincova P, Pasak M.
Kolenak R, et al. Among authors: kostolny i.
Materials (Basel). 2021 Oct 25;14(21):6369. doi: 10.3390/ma14216369.
Materials (Basel). 2021.
PMID: 34771894
Free PMC article.
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