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fu peng huo
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Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging.
Materials (Basel). 2020 Feb 12;13(4):831. doi: 10.3390/ma13040831.
Materials (Basel). 2020.
PMID: 32059528
Free PMC article.
Microstructures and Properties of Sn2.5Ag0.7Cu0.1RE Composite Solders Reinforced with Cu-Coated Graphene Nanosheets Synthesized by Pyrolysis.
Zhang M, Zhang KK, Huo FP, Wang HG, Wang Y.
Zhang M, et al.
Materials (Basel). 2019 Jan 17;12(2):289. doi: 10.3390/ma12020289.
Materials (Basel). 2019.
PMID: 30658465
Free PMC article.
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