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Page 1
Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering.
Sci Rep. 2019 Oct 16;9(1):14862. doi: 10.1038/s41598-019-51179-9.
Sci Rep. 2019.
PMID: 31619710
Free PMC article.
Active electrode arrays by chip embedding in a flexible silicone carrier.
Vanden Bulcke M, Baert K, Beyne E, Gonzalez M, Winters C, Webers T.
Vanden Bulcke M, et al. Among authors: beyne e.
Conf Proc IEEE Eng Med Biol Soc. 2006;2006:2811-5. doi: 10.1109/IEMBS.2006.260786.
Conf Proc IEEE Eng Med Biol Soc. 2006.
PMID: 17946138
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