Full-Scale Use of Microwave Heating in Construction of Longitudinal Joints and Crack Healing in Asphalt Pavements

Materials (Basel). 2021 Sep 8;14(18):5159. doi: 10.3390/ma14185159.

Abstract

Asphalt pavement construction technology is an industry branch that undergoes constant development. Analyzing the directions of the development, one can divide it into two mainstreams: the development of roadworks equipment and the development of roadworks technology. Microwave heating technique has been mentioned in the road industry from the early '70s, but research records from practical full-scale use are very rare. This article presents the evaluation of the possible use of microwave heating technique during a particular aspect of the construction process, namely, the formation of longitudinal joints and the potential repair process of the cracked asphalt pavement. Research results showed that joints constructed using microwave-assisted heating performed the same or even better with regards to tensile characteristics comparing to other techniques. Also, the highest level of compaction was reached among the other tested techniques applied to the wearing course level. The second part of the research experiment showed the large potential of the microwave crack healing technique. The asphalt pavement was healed on its full depth of 10 cm with the single healing operation applied. Although some limitations may occur in the practical use of microwave heating, the test results suggest that it is a very promising technique and should be further developed (for, e.g., shielding concerns, electricity supply). The microwave heating technique is powered with electricity, which is important when there is a constant need for further reductions of CO2 emissions. It can be reached in parallel with clean energy or clean electricity sources.

Keywords: asphalt mix; asphalt pavement; asphalt pavement repair; cracks-healing; dielectric heating; longitudinal joints; mechanical properties; microwave heating; physical properties; self-healing.