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Ultrasound assisted dispersal of a copper nanopowder for electroless copper activation.
Ultrason Sonochem. 2016 Mar;29:428-38. doi: 10.1016/j.ultsonch.2015.10.016. Epub 2015 Oct 24.
Ultrason Sonochem. 2016.
PMID: 26585024
Free article.
Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor.
Hamid Y, Hutt DA, Whalley DC, Craddock R.
Hamid Y, et al. Among authors: hutt da.
Sensors (Basel). 2020 Mar 19;20(6):1727. doi: 10.3390/s20061727.
Sensors (Basel). 2020.
PMID: 32204556
Free PMC article.
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The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives.
Wang S, Zhou Z, Goulas A, Critchlow GW, Whalley DC, Hutt DA.
Wang S, et al. Among authors: hutt da.
ACS Appl Mater Interfaces. 2024 Jan 10;16(1):1846-1860. doi: 10.1021/acsami.3c14900. Epub 2023 Dec 19.
ACS Appl Mater Interfaces. 2024.
PMID: 38113398
Free PMC article.
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