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chuanxiong chen
(216 results)?
Printable and Flexible Copper-Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance.
ACS Appl Mater Interfaces. 2017 Jul 26;9(29):24711-24721. doi: 10.1021/acsami.7b05308. Epub 2017 Jul 17.
ACS Appl Mater Interfaces. 2017.
PMID: 28675295
Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining.
Kim D, Yamamoto Y, Nagao S, Wakasugi N, Chen C, Suganuma K.
Kim D, et al. Among authors: chen c.
Micromachines (Basel). 2019 Oct 31;10(11):745. doi: 10.3390/mi10110745.
Micromachines (Basel). 2019.
PMID: 31683662
Free PMC article.
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Low temperature SiC die-attach bonding technology by hillocks generation on Al sheet surface with stress self-generation and self-release.
Chen C, Suganuma K.
Chen C, et al.
Sci Rep. 2020 Jun 3;10(1):9042. doi: 10.1038/s41598-020-66069-8.
Sci Rep. 2020.
PMID: 32494058
Free PMC article.
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Alloying and Embedding of Cu-Core/Ag-Shell Nanowires for Ultrastable Stretchable and Transparent Electrodes.
Zhang B, Li W, Nogi M, Chen C, Yang Y, Sugahara T, Koga H, Suganuma K.
Zhang B, et al. Among authors: chen c.
ACS Appl Mater Interfaces. 2019 May 22;11(20):18540-18547. doi: 10.1021/acsami.9b04169. Epub 2019 May 14.
ACS Appl Mater Interfaces. 2019.
PMID: 31055926
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Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni⁻P Layers for High-Temperature Applications of Power Device Modules.
Choe C, Chen C, Noh S, Suganuma K.
Choe C, et al. Among authors: chen c.
Materials (Basel). 2018 Nov 28;11(12):2394. doi: 10.3390/ma11122394.
Materials (Basel). 2018.
PMID: 30486503
Free PMC article.
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