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balint medgyesi
(1 results)?
Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films.
Materials (Basel). 2019 Nov 3;12(21):3609. doi: 10.3390/ma12213609.
Materials (Basel). 2019.
PMID: 31684157
Free PMC article.
On the Electrochemical Migration Mechanism of Gold in Electronics-Less Reliable Than Expected?
Medgyes B, Gharaibeh A, Rigler D, Harsányi G.
Medgyes B, et al.
Materials (Basel). 2021 Sep 12;14(18):5237. doi: 10.3390/ma14185237.
Materials (Basel). 2021.
PMID: 34576462
Free PMC article.
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