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Kim H, Kim M, Lee A, Park HL, Jang J, Bae JH, Kang IM, Kim ES, Lee SH.Kim H, et al. Among authors: lee sh, lee a.Adv Sci (Weinh). 2023 Jul;10(19):e2300659. doi: 10.1002/advs.202300659. Epub 2023 May 15.Adv Sci (Weinh). 2023.PMID: 37189211Free PMC article.
Lee SH, Park HL, Kim MH, Kang S, Lee SD.Lee SH, et al. Among authors: lee sd.ACS Appl Mater Interfaces. 2019 Aug 21;11(33):30108-30115. doi: 10.1021/acsami.9b10491. Epub 2019 Aug 12.ACS Appl Mater Interfaces. 2019.PMID: 31364349
Lee SH, Park HL, Kim MH, Kim MH, Park BG, Lee SD.Lee SH, et al. Among authors: lee sd.ACS Appl Mater Interfaces. 2020 Nov 18;12(46):51719-51728. doi: 10.1021/acsami.0c15519. Epub 2020 Nov 5.ACS Appl Mater Interfaces. 2020.PMID: 33151051
Park HL , Kim MH , Kim MH , Lee SH .Park HL , et al. Among authors: lee sh.Nanoscale. 2020 Nov 28;12(44):22502-22510. doi: 10.1039/d0nr06964g. Epub 2020 Nov 11.Nanoscale. 2020.PMID: 33174583
Lee G, Park HL, Lee SH, Kim MH, Lee SD.Lee G, et al. Among authors: lee sh, lee sd.J Nanosci Nanotechnol. 2021 Jul 1;21(7):3923-3928. doi: 10.1166/jnn.2021.19242.J Nanosci Nanotechnol. 2021.PMID: 33715718
Min SR, Cho MS, Lee SH, Park J, An HD, Kim GU, Yoon YJ, Seo JH, Jang JW, Bae JH, Lee SH, Kang IM.Min SR, et al. Among authors: lee sh.Materials (Basel). 2022 Jan 21;15(3):819. doi: 10.3390/ma15030819.Materials (Basel). 2022.PMID: 35160771Free PMC article.
Lee WY, Kim DW, Kim HJ, Kim K, Lee SH, Bae JH, Kang IM, Kim K, Jang J.Lee WY, et al. Among authors: lee sh.ACS Appl Mater Interfaces. 2022 Mar 2;14(8):10558-10565. doi: 10.1021/acsami.1c23955. Epub 2022 Feb 17.ACS Appl Mater Interfaces. 2022.PMID: 35175718
Kim HJ, Kim DW, Lee WY, Kim K, Lee SH, Bae JH, Kang IM, Kim K, Jang J.Kim HJ, et al. Among authors: lee sh, lee wy.Materials (Basel). 2022 Mar 3;15(5):1899. doi: 10.3390/ma15051899.Materials (Basel). 2022.PMID: 35269129Free PMC article.
Kim DW, Kim HJ, Lee WY, Kim K, Lee SH, Bae JH, Kang IM, Kim K, Jang J.Kim DW, et al. Among authors: lee sh, lee wy.Materials (Basel). 2022 Mar 5;15(5):1943. doi: 10.3390/ma15051943.Materials (Basel). 2022.PMID: 35269170Free PMC article.
Lee WY, Kim K, Lee SH, Bae JH, Kang IM, Park M, Kim K, Jang J.Lee WY, et al. Among authors: lee sh.ACS Omega. 2022 Mar 15;7(12):10262-10267. doi: 10.1021/acsomega.1c06870. eCollection 2022 Mar 29.ACS Omega. 2022.PMID: 35382319Free PMC article.