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Inkjet printing technology for increasing the I/O density of 3D TSV interposers.
Microsyst Nanoeng. 2017 Apr 10;3:17002. doi: 10.1038/micronano.2017.2. eCollection 2017.
Microsyst Nanoeng. 2017.
PMID: 31057857
Free PMC article.
A Micromachined Coupled-Cantilever for Piezoelectric Energy Harvesters.
Vyas A, Staaf H, Rusu C, Ebefors T, Liljeholm J, Smith AD, Lundgren P, Enoksson P.
Vyas A, et al. Among authors: ebefors t.
Micromachines (Basel). 2018 May 21;9(5):252. doi: 10.3390/mi9050252.
Micromachines (Basel). 2018.
PMID: 30424185
Free PMC article.
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