High-fidelity model to predict heat transfer enhancement for liquid film boiling on uniform micro-structured wicking surfaces

Affiliations

• ¹ Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, USA.
• ² Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, USA.
• ³ Materials Research Laboratory, University of Illinois Urbana-Champaign, USA.
• ⁴ International Institute for Carbon Neutral Energy Research (WPI-I2CNER), Kyushu University, Japan.
• ⁵ Institute for Sustainability, Energy and Environment (iSEE), University of Illinois Urbana-Champaign, USA.