Impact of Ceramic Micropillar Array and Fiber Layer Composite Structure on Kinematic and Heat Transfer Characteristics of Single Droplet Impacting a Wall

Micromachines (Basel). 2024 Apr 14;15(4):525. doi: 10.3390/mi15040525.

Abstract

The well-known limitations of spray cooling on high-temperature solids at the Leidenfrost temperature point have been significantly improved by a composite structure of steel micropillar arrays and insulating thin films. However, the physical mechanism of a single droplet impact on the walls of high-temperature composite structures in spray cooling remains elusive. We have experimentally studied and quantified the kinematic and thermal transfer characteristics of a single droplet impacting high-temperature micropillar arrays with fiber membrane composite structures. In particular, micropillar arrays of ceramic materials of different shapes (rectangular and cylindrical) used in this study were made using the more flexible PμSL technique, for which precision reaches the micron level. The results show that the presence and different layouts (embedded or placed on top) of the fiber layer significantly affect the spreading coefficient and thermal transfer efficiency of the droplets after impact. In terms of kinematic characteristics, unrelated to the structure of micropillar arrays, compared to structures without film, the maximum spreading coefficient of droplets significantly increased by more than 40% (43% for rectangular, 46% for cylindrical) when the fiber film was placed on top, and increased by more than 20% (20% for rectangular, 33% for cylindrical) when the fiber film was embedded. In terms of thermal transfer characteristics, at a temperature of 200 °C, the presence of the fiber layer changed the wettability of the surface of the micropillar structure, leading to a certain extension of the total evaporation time of the droplets compared to the surface of the micropillar structure without film.

Keywords: Leidenfrost effect; droplet impingement; droplet spreading; fiber membranes; heat transfer; microcolumn array.