In this paper, the electrothermal coupling model of metal oxide resistive random access memory (RRAM) is analyzed by using a 2D axisymmetrical structure in COMSOL Multiphysics simulation software. The RRAM structure is a Ti/HfO2/ZrO2/Pt bilayer structure, and the SET and RESET processes of Ti/HfO2/ZrO2/Pt are verified and analyzed. It is found that the width and thickness of CF1 (the conductive filament of the HfO2 layer), CF2 (the conductive filament of the ZrO2 layer), and resistive dielectric layers affect the electrical performance of the device. Under the condition of the width ratio of conductive filament to transition layer (6:14) and the thickness ratio of HfO2 to ZrO2 (7.5:7.5), Ti/HfO2/ZrO2/Pt has stable high and low resistance states. On this basis, the comparison of three commonly used RRAM metal top electrode materials (Ti, Pt, and Al) shows that the resistance switching ratio of the Ti electrode is the highest at about 11.67. Finally, combining the optimal conductive filament size and the optimal top electrode material, the I-V hysteresis loop was obtained, and the switching ratio Roff/Ron = 10.46 was calculated. Therefore, in this paper, a perfect RRAM model is established, the resistance mechanism is explained and analyzed, and the optimal geometrical size and electrode material for the hysteresis characteristics of the Ti/HfO2/ZrO2/Pt structure are found.
Keywords: COMSOL; conductive filament; electrothermal coupling model; resistance switching.