This study introduces a post-treatment process, the subpressure-driven soft deformation method, to reduce inherent voids in Material Extrusion (MEX) components. By subjecting printed green components to heat treatment under subpressure, the process enhances viscosity, effectively filling voids formed between deposited tracks. The average porosities of the samples sintered from the green components without and with soft deformation are calculated to be 3.55% and 2.36%, respectively. A comparison of the tensile strengths and fracture surfaces of the sintered samples with and without soft deformation treatment indicated that the sintered samples with soft deformation treatment exhibited narrower standard deviation for the various mechanical properties. Capillary rheometer calculations indicate feedstock viscosity to be between 450.34 and 1018.31 Pa s under subpressure, diminishing inter-track voids without sizeable dimensional changes. Molecular dynamics simulation demonstrates a 3.7-fold increase in bond strength, indicating intertrack voids effectively eliminated. Reduced inter-particle distances facilitate necking, grain growth, and improved sintered density.
Keywords: All-atom molecular dynamics simulations; Inherent voids; Material extrusion (MEX); Subpressure-driven soft deformation.
© 2024 The Authors.