Tensile and Shear Creep Behavior of Structural Adhesives: Experiments and Modeling

Appl Compos Mater (Dordr). 2024;31(2):739-764. doi: 10.1007/s10443-023-10184-y. Epub 2023 Dec 30.

Abstract

Structural adhesives characterized a turning point in the post-connection of structural elements due to their excellent performances and ability to transfer stress without losing their integrity. These materials are typically particle-reinforced composites made by a thermoset polymer matrix and fillers. During the in-situ application of this material, the thermal activation of the polymer is typically not possible, leading to an undefined degree of cure and therefore to a variation of the mechanical performance over time. This altering means that after applying a sustained load on a bonded anchor system installed at regular temperature, the adhesive changes material properties. Ample studies convince that the progressive increase of the degree of cure of the thermosetting polymer leads to higher strength and stiffness. However, limited studies have been dedicated to the post-curing effects on the long-term behavior. The main goal of this work is to investigate the tensile and shear creep behavior of two commercially available structural adhesives and the influence of curing conditions on their long-term performances. An extensive experimental campaign comprising short and long-term characterizations has been carried out on specimens subjected to three different curing and post-curing protocols, with the scope of imitating relevant in-situ conditions. The results demonstrate that structural adhesives cured at higher temperatures are less subjected to creep deformations. As a material equation, the generalized Kelvin model is utilized to fit the tensile and shear creep data, and two continuous creep spectra have been selected to represent the creep behavior and facilitate extrapolations to the long-term behavior.

Keywords: Continuous spectrum; Creep; Curing; Structural adhesive; Thermoset polymers.