Enhancing Dielectric Properties of (CaCu3Ti4O12 NWs-Graphene)/PVDF Ternary Oriented Composites by Hot Stretching

Wenning Qi; Liuyang Li; Ruolin Han; Yanbin Hou; Zheng Zhou; Guang-Xin Chen; Qifang Li

doi:10.1021/acsomega.3c10111

Enhancing Dielectric Properties of (CaCu₃Ti₄O₁₂ NWs-Graphene)/PVDF Ternary Oriented Composites by Hot Stretching

ACS Omega. 2024 Mar 7;9(11):13298-13305. doi: 10.1021/acsomega.3c10111. eCollection 2024 Mar 19.

Authors

Wenning Qi¹, Liuyang Li², Ruolin Han¹, Yanbin Hou¹, Zheng Zhou¹, Guang-Xin Chen¹, Qifang Li²

Affiliations

¹ College of Material Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, PR China.
² Key Laboratory of Carbon Fiber and Functional Polymers, Ministry of Education, Beijing University of Chemical Technology, Beijing 100029, PR China.

Abstract

Using high-dielectric inorganic ceramics as fillers can effectively increase the dielectric constant of polymer-based composites. However, a high percentage of fillers will inevitably lead to a decrease in the mechanical toughness of the composite materials. By introducing high aspect ratio copper calcium titanate (CaCu₃Ti₄O₁₂) nanowires (CCTO NWs) and graphene as fillers, the ternary poly(vinylidene fluoride) (PVDF)-based composites (CCTO NWs-graphene)/PVDF with a significant one-dimensional orientation structure were prepared by hot stretching. CCTO NWs and graphene are arranged in a directional manner to form a large number of microcapacitor structures, which significantly improves the dielectric constant of the composites. When the ratio of CCTO NWs and graphene is 0.2 and 0.02, the oriented composites have the highest dielectric constant, which is 19.3% higher than the random composites, respectively. Numerical simulations reveal that the introduction of graphene and the construction of the one-dimensional oriented microstructure have a positive effect on improving the dielectric properties of the composites. This study provides a strategy to improve the dielectric properties of composite materials by structural design without changing the filler content, which has broad application prospects in the field of electronic devices.