We present an investigation of the interpad region (IP) in the Ultra-Fast Silicon Detector (UFSD) Type 10, utilizing a femtosecond laser and the transient current technique (TCT). We elucidate the isolation structure and measure the IP distance between pads, comparing it to the nominal value provided by the vendor. A comparison of sensors with identical layouts but different nominal IP distances (49 μm vs. 61 μm) and different processing parameters revealed their significant different charge collection properties in the IP.
Keywords: 4D tracking; Bias ring; Fill factor; Interpad layout; Isolation structures; JTE; Segmented LGAD; UFSD; p-stop; pCT.
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