Although epoxy-based composites that consist of inorganic fillers and matrixes are widely used in "conventional" electronic packaging applications due to their excellent insulation and robust properties, they limit their uses in "advanced electronic packaging" which requires enhanced thermal conductivity. However, conventional thermal curing methods for fabrication of epoxy-based composites do not fulfill sufficient thermal conductivity. Herein, we apply photo-induced curing strategy for fabricating alumina-incorporated epoxy-siloxane composites that consist of sol-gel derived siloxane matrix and bimodal sized alumina particles as a thermally conductive filler. We investigate how curing mechanism (thermal- or UV-curing) and varying the ratios of the alumina particles of two different sizes affect the various physical properties. It is found that photo-curing process makes greatly enhanced thermal conductivity, low thermal expansion, and high mechanical robustness compared to thermally-cured composites. As the results, we can achieve significantly enhanced thermal conductivity (>11 W/m K) with high thermal stability and mechanical robustness.
Keywords: Alumina particle; Electronic packaging; Epoxy-siloxane composites; Thermal conductivity.
© 2024 The Authors.