As a new trend in plasma surface engineering, plasma conditions that allow more-defined chemical reactions at the surface are being increasingly investigated. This is achieved by avoiding high energy deposition via ion bombardment during direct plasma exposure (DPE) causing destruction, densification, and a broad variety of chemical reactions. In this work, a novel approach is introduced by placing a polymer mesh with large open area close to the plasma-sheath boundary above the plasma-treated sample, thus enabling near-plasma chemistry (NPC). The mesh size effectively extracts ions, while reactive neutrals, electrons, and photons still reach the sample surface. The beneficial impact of this on the plasma activation of poly (tetrafluoroethylene) (PTFE) to enhance wettability and on the plasma polymerization of siloxanes, combined with the etching of residual hydrocarbons to obtain highly porous SiOx coatings at low temperatures, is discussed. Characterization of the treated samples indicates a predominant chemical modification yielding enhanced film structures and durability.
Keywords: low-pressure plasma; plasma etching; plasma polymerization; porous SiOx; surface reactions; wettability.