This paper introduces a novel reconfigurable technique for partitioning the propagation of surface waves by utilizing a T-shaped structure and pathways established through the introduction of fluid metal or metal pins into evenly spaced cylindrical cavities within a porous surface wave platform. Notably, the co-printing of metal and dielectric materials via 3D printing is employed, resulting in an expedited fabrication process. Extensive 3D electromagnetic simulations and experimental investigations validate the proposed approach's efficacy in achieving surface wave division while minimizing interference. The study encompasses an exploration of diverse power distribution ratios achievable within the distributed surface waves. Critical physical parameters of the T-junction are comprehensively examined, including partition depth, junction geometry, output port symmetry, and asymmetry. Additionally, the research delves into the frequency-dependent behaviours of asymmetric T-junctions and pathways. These findings establish the groundwork for adaptable architectures, facilitating concurrent communication among multiple devices within a unified surface wave communication network. This innovation holds potential to enhance various applications through improved communication capabilities.
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