Specimens for quality transmission electron microscopy (TEM) analyses must fulfil a range of requirements, which demand high precision during the prior preparation process. In this work, an optimized procedure for conventional TEM specimen preparation is presented that exploits the thickness-dependence of interference colors occurring in birefringent materials. It facilitates the correct estimation of specimen thickness to avoid damage or breaking during mechanical thinning and reduces ion-milling times below 30 min. The benefits of the approach are shown on sapphire and silicon carbide cross-section samples. The presented method is equally suitable for assessing specimen thickness during dimpling and wedge-polishing, and is particularly useful at thicknesses below 20 µm, where the accuracy of mechanical techniques is insufficient. It is precise enough to be employed for a visual thickness estimation during the thinning process, but can be additionally optimized by analyzing the RGB spectrum of the occurring interference colors.
Keywords: Birefringence; Dimpling; Interference; Sample preparation; TEM; Wedge-polishing.
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