Transparent glass substrates are routinely used in the fabrication of metasurfaces, augmented reality (AR), virtual reality (VR), and holographic devices. While readily compatible with photolithographic patterning methods, when electron beam (E-Beam) techniques are used, field distortion and stitching errors can result due to the buildup of charge. A common approach to overcome this issue is to deposit a thin conductive polymer layer (E-Spacer). However, if high-voltage E-Beam is used to achieve nano-features, the polymer conductivity is not sufficient. We have shown that by using chromium (Cr) as an overcoating conductive layer on the resist, we can achieve accurate and seamless patterning in multiple writing fields and used the method to fabricate on-chip Si3N4 waveguides on SiO2. This technique has the potential to enable the fabrication of large-scale integrated photonic systems on transparent or dielectric substrates.