Modern highly integrated microelectronic devices are unable to dissipate heat over time, which greatly affects the operating efficiency and service life of electronic equipment. Constructing high-thermal-conductivity composites with 3D network structures is a hot research topic. In this article, carbon fiber felt (CFF) was prepared by airflow netting forming technology and needle punching combined with stepped heat treatment. Then, carbon-coated carbon fiber felt (C@CFF) with a three-dimensional network structure was constructed in situ by high-temperature chemical vapor deposition (CVD). Finally, high-temperature treatment was used to improve the degree of crystallinity of C@CFF and further enhance its graphitization. The epoxy (EP) composites were prepared by simple vacuum infiltration-molding curing. The test results showed that the in-plane thermal conductivity (K∥) and through-plane thermal conductivity (K⊥) of EP/C@CFF-2300 °C could reach up to 13.08 and 2.78 W/mK, respectively, where the deposited carbon content was 11.76 vol %. The in-plane thermal conductivity enhancement (TCE) of EP/C@CFF-2300 °C was improved by 6440 and 808% compared to those of pure EP and EP/CFF, respectively. The high-temperature treatment greatly provides an improvement in thermal conductivity for the in-plane and the through-plane. Infrared imaging showed excellent thermal management properties of the prepared epoxy composites. EP/C@CFF-2300 °C owned an in-plane AC conductivity of up to 0.035 S/cm at 10 kHz, and Lorentz-Drude-type negative permittivity behaviors were observed at the tested frequency region. The CFF thermally conductive composites prepared by the above method have a broad application prospect in the field of advanced thermal management and electromagnetics.
Keywords: carbon coating; carbon fiber; chemical vapor deposition; thermal conductivity; three-dimensional network structure.