In situ TEM mechanical stages based on micro-electromechanical systems (MEMS) have developed rapidly over recent decades. However, image-based quantification of MEMS mechanical stages suffers from the trade-off between spatial and temporal resolutions. Here, by taking in situ TEM nanoindentation as an example, we developed a novel method for image-based quantified in situ TEM mechanical tests with both high spatial and temporal resolutions. A reference beam was introduced to the close vicinity of the indenter-sample region. By arranging the indenter, the sample, and the reference beam in a micron-sized area, the indentation depth and load can be directly and dynamically acquired from the relative motion of markers on the three components, while observing the indentation process at a relatively high magnification. No alteration of viewing area is involved throughout the process. Therefore, no deformation events will be missed, and the collection rate of quantification data can be raised significantly.
Keywords: MEMS chip; focused ion beam; in situ TEM; mechanical quantification; nanoindentation.