Neuromorphic Engineering: From Materials to Device Application

Affiliations

• ¹ Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, CA, 90089, USA.
• ² Unité Mixte de Physique, CNRS, Thales Université Paris-Saclay, Palaiseau, 91767, France.
• ³ Department of Electrical and Computer Engineering, Texas A&M University, College Station, TX, 77843, USA.
• ⁴ Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, 100871, China.
• ⁵ Center for Brain Inspired Chips, Institute for Artificial Intelligence, Peking University, Beijing, 100871, China.