Atomic Layer Deposition of Titanium Oxide-Based Films for Semiconductor Applications-Effects of Precursor and Operating Conditions

Materials (Basel). 2023 Aug 8;16(16):5522. doi: 10.3390/ma16165522.

Abstract

Two widely used atomic layer deposition precursors, Tetrakis (dimethylamido) titanium (TDMA-Ti) and titanium tetrachloride (TiCl4), were investigated for use in the deposition of TiOx-based thin films as a passivating contact material for solar cells. This study revealed that both precursors are suited to similar deposition temperatures (150 °C). Post-deposition annealing plays a major role in optimising the titanium oxide (TiOx) film passivation properties, improving minority carrier lifetime (τeff) by more than 200 µs. Aluminium oxide deposited together with titanium oxide (AlOy/TiOx) reduced the sheet resistance by 40% compared with pure TiOx. It was also revealed that the passivation quality of the (AlOy/TiOx) stack depends on the precursor and ratio of AlOy to TiOx deposition cycles.

Keywords: ALD precursors; atomic layer deposition; passivation films; titanium oxide.

Grants and funding

The FIB preparation was performed at the SMART-H infrastructure, funded by The Research Council of Norway (RCN), grant 296197. The TEM work was carried out at the NORTEM infrastructure, RCN grant 197405.