To develop a lower-cost, excellent-performance, and environmentally friendly phenol-formaldehyde (PF) resin, soybean meal was used to modify PF resin, and soybean meal-phenol-formaldehyde (SMPF) resins were prepared. This reveals the effect of soybean meal on the structural, bonding, and curing properties of PF resin, which are very important for its applications in the wood industry. The resins' physicochemical properties and curing performance were investigated, showing that SMPF resins have higher curing temperatures than PF resin. The Fourier transform infrared spectroscopy results indicated that a cross-linking reaction occurred between the amino groups of soybean protein and the hydroxymethyl phenol. Moreover, with the addition of soybean meal, the viscosity of SMPF increased while the gel time decreased. It is worth mentioning that SMPF-2 resin has favorable viscosity, short gel time, low curing temperature (135.78 °C), and high water resistance and bonding strength (1.01 MPa). Finally, all the plywoods bonded with SMPF resins have good water resistance and bonding strength, which could meet the standard (GB/T 17657-2013, type I) for plywood. The optimized SMPF resins showed the potential for application to partially replace PF resin in the wood industry.
Keywords: curing; phenol–formaldehyde resin; plywood; soy-based adhesives; soybean meal.