The integration and miniaturization of contemporary electronics have led to significant challenges in dealing with electromagnetic (EM) radiation and heat accumulation. Despite these issues, achieving high thermal conductivity (TC) and electromagnetic interference (EMI) shielding effectiveness (SE) in polymer composite films remains an exceptionally difficult task. In this work, we used a straightforward in situ reduction process and a vacuum-drying method to successfully prepare a flexible Ag NPs/chitosan (CS)/PVA nanocomposite with three-dimensional (3D) conductive and thermally conductive network architectures. The 3D silver pathways formed by attaching to the chitosan fibers endow the material with simultaneous exceptional TC and EMI capabilities. At a silver concentration of 25 vol %, the TC of Ag NPs/CS/PVA nanocomposites reaches 5.18 W·m-1·K-1, exhibiting an approximately 25 times increase compared to CS/PVA composites. The electromagnetic shielding performance of 78.5 dB significantly outperforms the specifications of standard commercial EMI shielding applications by a significant margin. Additionally, Ag NPs/CS/PVA nanocomposites have greatly benefited from microwave absorption (SEA), effectively impeding the transmission of EM waves and reducing the reflected secondary EM wave pollution. Meanwhile, the composite material still maintains good mechanical properties and bendability. This endeavor helped develop malleable and durable composites that possess superior EMI shielding capabilities and intriguing heat dissipation properties using innovative design and fabrication methods.
Keywords: chemical deposition; chitosan; electromagnetic interference shielding; poly(vinyl alcohol); silver nanoparticles; thermal conductivity.