In this study, an electrostatic force-driven on-chip tester consisting of a mass with four guided cantilever beams was employed to extract the process-related bending stiffness and piezoresistive coefficient in-situ for the first time. The tester was manufactured using the standard bulk silicon piezoresistance process of Peking University, and was tested on-chip without additional handling. In order to reduce the deviation from process effects, the process-related bending stiffness was first extracted as an intermediate value, namely, 3590.74 N/m, which is 1.66% lower than the theoretical value. Then, the value was used to extract the piezoresistive coefficient using a finite element method (FEM) simulation. The extracted piezoresistive coefficient was 9.851 × 10-10 Pa-1, which essentially matched the average piezoresistive coefficient of the computational model based on the doping profile we first proposed. Compared with traditional extraction methods, such as the four-point bending method, this test method is on-chip, achieving automatic loading and precise control of the driving force, so it has high reliability and repeatability. Because the tester is manufactured together with the MEMS device, it has the potential to be used for process quality evaluation and monitoring on MEMS sensor production lines.
Keywords: MEMS; effective stiffness; parameters extraction; piezoresistive coefficient.