Bistable Boron-Related Defect Associated with the Acceptor Removal Process in Irradiated p-Type Silicon-Electronic Properties of Configurational Transformations

Sensors (Basel). 2023 Jun 19;23(12):5725. doi: 10.3390/s23125725.

Abstract

The acceptor removal process is the most detrimental effect encountered in irradiated boron-doped silicon. This process is caused by a radiation-induced boron-containing donor (BCD) defect with bistable properties that are reflected in the electrical measurements performed in usual ambient laboratory conditions. In this work, the electronic properties of the BCD defect in its two different configurations (A and B) and the kinetics behind transformations are determined from the variations in the capacitance-voltage characteristics in the 243-308 K temperature range. The changes in the depletion voltage are consistent with the variations in the BCD defect concentration in the A configuration, as measured with the thermally stimulated current technique. The A→B transformation takes place in non-equilibrium conditions when free carriers in excess are injected into the device. B→A reverse transformation occurs when the non-equilibrium free carriers are removed. Energy barriers of 0.36 eV and 0.94 eV are determined for the A→B and B→A configurational transformations, respectively. The determined transformation rates indicate that the defect conversions are accompanied by electron capture for the A→B conversion and by electron emission for the B→A transformation. A configuration coordinate diagram of the BCD defect transformations is proposed.

Keywords: LGAD; TSC technique; acceptor removal; bistable defect; boron-doped irradiated silicon; configurational transformations; radiation hard detectors.

MeSH terms

  • Boron*
  • Electronics
  • Electrons
  • Kinetics
  • Silicon*

Substances

  • Boron
  • Silicon