Ag Nanoparticle-Thiolated Chitosan Composite Coating Reinforced by Ag-S Covalent Bonds with Excellent Electromagnetic Interference Shielding and Joule Heating Performances

ACS Appl Mater Interfaces. 2023 Jun 14;15(23):28465-28475. doi: 10.1021/acsami.3c02808. Epub 2023 May 31.

Abstract

Conductive composite coatings are an important element in flexible electronics research and are widely used in energy transformation, artificial intelligence, and electronic skins. However, the comparatively low electrical conductivity limits their performance in many specific applications, such as electromagnetic interference (EMI) shielding and Joule heating devices. Therefore, the preparation of ultrahigh-electrical conductivity composite coatings with good flexibility and durability remains a great challenge. Herein, we fabricated multifunctional conductive composite coatings based on thiolated chitosan (TCS) and Ag nanoparticles (AgNPs) by an eco-friendly drop-coating method. The three-dimensional conductive network constructed by thermal sintering imparted the coating with an ultrahigh electrical conductivity of up to 67079.4 S/m. Moreover, the coating reinforced by Ag-S covalent bonding exhibits good stability, including heat resistance, chemical resistance, and mechanical stability. In addition, based on the ultrahigh electrical conductivity, the coating exhibits superior EMI shielding effectiveness and Joule heating capability. With 30 wt % of AgNPs in the coating, the EMI shielding effectiveness of the coating reaches 70.2 dB, far exceeding commercial standards. Additionally, the coating can quickly reach a saturation temperature (Ts) of 195.9 °C at a safe drive voltage of 3 V. These excellent performances demonstrate that the robust and flexible highly conductive composite coatings prepared by this method have attractive potential for EMI shielding and thermal management applications as well as in wearable electronics.

Keywords: Ag nanoparticles; Ag−S covalent bond; EMI shielding; Joule heating; multifunctional coating.