Hydrogen iodide (HI) neutral beam etching characteristics of InGaN and GaN for micro-LED fabrication

Abstract

We investigated the etching characteristics of hydrogen iodide (HI) neutral beam etching (NBE) of GaN and InGaN and compared with Cl₂NBE. We showed the advantages of HI NBE versus Cl₂NBE, namely: higher InGaN etch rate, better surface smoothness, and significantly reduced etching residues. Moreover, HI NBE was suppressed of yellow luminescence compared with Cl₂plasma. InCl_xis a product of Cl₂NBE. It does not evaporate and remains on the surface as a residue, resulting in a low InGaN etching rate. We found that HI NBE has a higher reactivity with In resulting in InGaN etch rates up to 6.3 nm min^-1, and low activation energy for InGaN of approximately 0.015 eV, and a thinner reaction layer than Cl₂NBE due to high volatility of In-I compounds. HI NBE resulted in smoother etching surface with a root mean square average (rms) of 2.9 nm of HI NBE than Cl₂NBE (rms: 4.3 nm) with controlled etching residue. Moreover, the defect generation was suppressed in HI NBE compared to Cl₂plasma, as indicated by lower yellow luminescence intensity increase after etching. Therefore, HI NBE is potentially useful for high throughput fabrication ofμLEDs.

Keywords: InGaN etching; defect-free fabrication; neutral beam etching.