Boosting Thermal Conductivity by Surface Plasmon Polaritons Propagating along a Thin Ti Film

Dong-Min Kim; Sinwoo Choi; Jungwan Cho; Mikyung Lim; Bong Jae Lee

doi:10.1103/PhysRevLett.130.176302

Boosting Thermal Conductivity by Surface Plasmon Polaritons Propagating along a Thin Ti Film

Phys Rev Lett. 2023 Apr 28;130(17):176302. doi: 10.1103/PhysRevLett.130.176302.

Authors

Dong-Min Kim^{1

2}, Sinwoo Choi^{1

2}, Jungwan Cho³, Mikyung Lim⁴, Bong Jae Lee^{1

2}

Affiliations

¹ Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, South Korea.
² Center for Extreme Thermal Physics and Manufacturing, Korea Advanced Institute of Science and Technology, Daejeon 34141, South Korea.
³ School of Mechanical Engineering, Sungkyunkwan University, Suwon 16419, South Korea.
⁴ Nano-Convergence Manufacturing Systems Research Division, Korea Institute of Machinery and Materials, Daejeon 34103, South Korea.

PMID: 37172259
DOI: 10.1103/PhysRevLett.130.176302

Abstract

We experimentally demonstrate boosted in-plane thermal conduction by surface plasmon polaritons (SPPs) propagating along a thin Ti film on a glass substrate. Due to the lossy nature of metal, SPPs can propagate over centimeter-scale distances even along a supported metal film, and the resulting ballistic heat conduction can be quantitatively validated. Further, for a 100-nm-thick Ti film on a glass substrate, a significant enhancement of in-plane thermal conductivity compared to bulk value (∼25%) is experimentally shown. This Letter will provide a new avenue to employ SPPs for heat dissipation along a supported thin film, which can be readily applied to mitigate hot-spot issues in microelectronics.