Sputtered anti-reflection layer on transparent polyimide - substrate improves adhesion strength to - copper layer: effects of layer thickness and sputtering power

Yuan-Nan Tsai; Shih-Chieh Chin; Hsin-Yo Chen; Ta-I Yang; Mei-Hui Tsai; I-Hsiang Tseng

doi:10.1039/d3ra02148c

Sputtered anti-reflection layer on transparent polyimide - substrate improves adhesion strength to - copper layer: effects of layer thickness and sputtering power

RSC Adv. 2023 May 5;13(20):13880-13885. doi: 10.1039/d3ra02148c. eCollection 2023 May 2.

Authors

Yuan-Nan Tsai^{1

2}, Shih-Chieh Chin³, Hsin-Yo Chen³, Ta-I Yang⁴, Mei-Hui Tsai^{2

3}, I-Hsiang Tseng⁵

Affiliations

¹ Department of Electronic Engineering, Lunghwa University of Science and Technology Guishan Taoyuan 333326 Taiwan.
² Graduate Institute of Precision Manufacturing, National Chin-Yi University of Technology Taichung 411030 Taiwan tsaimh@ncut.edu.tw.
³ Department of Chemical and Materials Engineering, National Chin-Yi University of Technology Taichung 411030 Taiwan tsaimh@ncut.edu.tw.
⁴ Department of Chemical Engineering, Chung-Yuan Christian University Chungli Taoyuan 320314 Taiwan.
⁵ Department of Chemical Engineering, Feng Chia University Taichung 407102 Taiwan ihtseng@fcu.edu.tw.

Abstract

In order to shield the electronic circuits on a transparent polyimide (PI) substrate, an anti-reflection (AR) layer was deposited on a PI film via DC reactive magnetron sputtering. The effects of sputtering power and thickness of AR layer on the optical property and adhesion strength of the PI were investigated. The composition of the AR layer influences the bonding between layers. Sufficient thickness of the AR layer is essential to strengthen the adhesion between the PI and copper (Cu) layers. The sputtered AR layer on the PI also improves the barrier property for water vapor. The AR layer-sputtered PI substrates remain transparent and exhibit high peel strength to the Cu layer, suggesting their potential applications as reliable transparent substrates for modern electronic devices.