GaN/Gr (2D)/Si (3D) Combined High-Performance Hot Electron Transistors

ACS Nano. 2023 May 9;17(9):8262-8270. doi: 10.1021/acsnano.2c12435. Epub 2023 May 1.

Abstract

To overcome the problem of minority carrier storage time in bipolar transistors, a hot electron transistor (HET) has been proposed. This device has the advantage of high working speed and some complex logic functions can be completed by using one component. Here, we demonstrate a mixed-dimensional HET composed of GaN/AlN microwires, graphene (Gr), and Si. The electrons between GaN/AlN are injected into graphene by an F-N tunneling mechanism to achieve high speed hot electrons, then cross graphene by ballistic transport, and are collected in a nearly lossless manner through a low-barrier Si. Therefore, the device shows a record DC gain of 16.2, a collection efficiency close to the limit of 99.9% based on the graphene hot electron transistor (GHET), an emitter current density of about 68.7 A/cm2, and a high on/off current ratio reaching ∼107. Meanwhile, the current saturation range is wide, beyond those of most GHETs. It has potential applications as a power amplifier.

Keywords: Si; gallium nitride; graphene; hot electron transistor; mixed-dimension; tunneling.