Due to the obvious numerous economic and technical consequences of the corrosion process, its inhibition is one of the most critical aspects of current research. A corrosion inhibitor for the bis-thiophene Schiff base copper-metal complex Cu(II)@Thy-2 was investigated here, which was synthesized via a coordination reaction with a bis-thiophene Schiff base (Thy-2) as a ligand and copper chloride (CuCl2-2H2O) as a ligand metal salt. When the corrosion inhibitor concentration was increased to 100 ppm, the self-corrosion current density Icoor reached a minimum of 2.207 × 10-5 A/cm2, the charge transfer resistance reached a maximum of 932.5 Ω·cm2, and the corrosion inhibition efficiency reached a maximum of 95.2%, with the corrosion inhibition efficiency showing a trend of increasing first and then decreasing with concentration increase. After adding Cu(II)@Thy-2 corrosion inhibitor, a uniformly distributed dense corrosion inhibitor adsorption film formed on the surface of the Q235 metal substrate, significantly improving the corrosion profile compared to both before and after the addition of the corrosion inhibitor. Before and after the addition of corrosion inhibitor, the metal surface's contact angle CA increased from 54.54° to 68.37°, showing that the adsorbed corrosion inhibitor film decreased the metal surface's hydrophilicity and increased its hydrophobicity.
Keywords: anticorrosion; corrosion inhibitor; electrochemistry; thiophene Schiff base.