The photosensitive resins for 3D printing technology have been widely applied throughout the advanced communication field due to their merits of high molding accuracy and fast processing speed. Regardless, they, in particular, should have better mechanical properties, heat resistance, and dielectric properties. Herein, photocurable fluorinated poly (phthalazinone ether) (FSt-FPPE) was utilized as a prepolymer to improve the performance of photosensitive resin. A series of UV-curable inks named FST/DPGs were prepared with FSt-FPPE and acrylic diluents of different mass fractions. The FST/DPGs were cured into films by UV curing and post-treatment. After curing, their properties were characterized in detail. In terms of heat resistance, glass transition temperature (Tg) could reach 233 °C and the 5% thermal decomposition temperature (Td5%) was 371 °C. The tensile strength surprisingly reached 61.5 MPa, and the dielectric constant (Dk) could be significantly reduced to 2.75. Additionally, FST/DPGs were successfully employed in UV-assisted direct writing (DIW) to print 3D objects that benefited from their commendable fluidity and rapid curing speed. A stiff cylinder sample with a smooth surface and distinct pattern was ultimately obtained, indicating their remarkable 3D printing adaptation. Such photosensitive resin for UV-assisted DIW exhibits tremendous potential in the electronic industry.
Keywords: dielectric constant; heat resistance; mechanical properties; photosensitive resin.