In situ x-ray photoelectron spectroscopy analysis of the atomic layer deposition of Al2O3on SiO x/Si: Interface dipole and persistent surface groups

Nanotechnology. 2023 Mar 30;34(24). doi: 10.1088/1361-6528/acc408.

Abstract

Atomic layer deposition (ALD) has become an essential technology in many areas. To better develop and use this technology, it is of the pivot to understand the surface chemistry during the ALD film growth. The growth of an ALD oxide film may also induce an electric dipole at the interface, which may be further tuned to modulate the flat band voltage for electronic device applications. To understand the associated surface chemistry and interface dipole formation process, we herein employ anin situx-ray photoelectron spectroscopy technique to study the ALD growth of Al2O3, from trimethylaluminum and H2O, on the SiOx/Si surface. We find that an electric dipole is formed at the Al2O3/SiOxinterface immediately after the first Al2O3layer is deposited. We also observe persistent surface methyl groups in the H2O half-cycle during ALD, and the amount of the persistent methyls is particularly higher during the initial Al2O3ALD growth, which suggests the formation of Si-CH3on the surface. These findings can provide useful routes and insights toward interface engineering by ALD.

Keywords: atomic layer deposition; high-k; interface dipole; surface chemistry; x-ray photoelectron spectroscopy.