Precision enhanced alignment bonding technique with sacrificial strategy

Qian Li; Zi Ye; Mingyang Liu; Wei Liu; Pan Zhang; Xiao Sun; Huimin Zhang; Zhenming Li; Lin Gui

doi:10.3389/fbioe.2023.1105154

Precision enhanced alignment bonding technique with sacrificial strategy

Front Bioeng Biotechnol. 2023 Feb 16:11:1105154. doi: 10.3389/fbioe.2023.1105154. eCollection 2023.

Authors

Qian Li^{1

2}, Zi Ye¹, Mingyang Liu³, Wei Liu³, Pan Zhang^{1

4}, Xiao Sun^{1

4}, Huimin Zhang^{1

2}, Zhenming Li³, Lin Gui^{1

4}

Affiliations

¹ CAS Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, China.
² School of Engineering Science, University of Chinese Academy of Sciences, Beijing, China.
³ Energy Storage and Novel Technology of Electrical Engineering Department, China Electric Power Research Institute, Beijing, China.
⁴ School of Future Technology, University of Chinese Academy of Sciences, Beijing, China.

Abstract

This work proposes an "N2-1" sacrificial strategy to help to improve the accuracy of the bonding technique from the existing level. The target micropattern is copied N2 times, and (N2-1) of them are sacrificed to obtain the most accurate alignment. Meanwhile, a method for manufacturing auxiliary solid alignment lines on transparent materials is proposed to visualize auxiliary marks and facilitate the alignment. Though the principle and procedure of alignment are straightforward, the alignment accuracy substantially improved compared to the original method. With this technique, we have successfully fabricated a high-precision 3D electroosmotic micropump just using a conventional desktop aligner. Because of the high precision during the alignment, the flow velocity is up to 435.62 μm/s at a driven voltage of 40 V, which far exceeds the previous similar reports. Thus, we believe that it has great potential for high precision microfluidic device fabrications.

Keywords: EOP; alignment; chip fabricating; liquid metal; sacrificial strategy.

Grants and funding

This work is supported by the Science and Technology Program from State Grid Corporation of China (No. 5700-202155453A-0-0-00): “Development of flexible liquid metal based micro-sensor with anti-electromagnetic interference ability for power engineering applications.”