The self-annealing phenomenon of electrodeposited nano-twin copper with high defect density

Haneul Han; Chaerin Lee; Youjung Kim; Jinhyun Lee; Sanghwa Yoon; Bongyoung Yoo

doi:10.3389/fchem.2022.1056596

The self-annealing phenomenon of electrodeposited nano-twin copper with high defect density

Front Chem. 2022 Nov 24:10:1056596. doi: 10.3389/fchem.2022.1056596. eCollection 2022.

Authors

Haneul Han¹, Chaerin Lee¹, Youjung Kim¹, Jinhyun Lee¹, Sanghwa Yoon¹, Bongyoung Yoo¹

Affiliation

¹ Department of Materials Science and Chemical Engineering, Hanyang University, Ansan, South Korea.

Abstract

Electroplated copper was prepared under typical conditions and a high defect density to study the effect of the defects on its self-annealing phenomenon. Two conditions, grain growth and stress relaxation during self-annealing, were analyzed with electron backscattered diffraction and a high-resolution X-ray diffractometer. Abnormal grain growth was observed in both conditions; however, the grown crystal orientation differed. The direction and relative rate at which abnormal grain growth proceeds were specified through textured orientation, and the self-annealing mechanism was studied by observing the residual stress changes over time in the films using the sin²Ψ method.

Keywords: electrodeposition; high current density; low temperature; nanotwins; self-annealing.