Surface-passivated Cu conductors for high-temperature sulfurous environments

Zheng Li; Jian Yu; Saurabh Khuje; Aaron Sheng; Marieross Navarro; Cheng-Gang Zhuang; Shenqiang Ren

doi:10.1039/d2na00452f

Surface-passivated Cu conductors for high-temperature sulfurous environments

Nanoscale Adv. 2022 Oct 25;4(23):5132-5136. doi: 10.1039/d2na00452f. eCollection 2022 Nov 22.

Authors

Zheng Li¹, Jian Yu², Saurabh Khuje¹, Aaron Sheng¹, Marieross Navarro¹, Cheng-Gang Zhuang³, Shenqiang Ren^{1

4

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Affiliations

¹ Department of Mechanical and Aerospace Engineering, University at Buffalo, The State University of New York Buffalo New York 14260 USA shenren@buffalo.edu.
² DEVCOM Army Research Laboratory Aberdeen Proving Ground MD 21005 USA.
³ Corning Research and Development Corporation New York 14830 USA.
⁴ Department of Chemistry, University at Buffalo, The State University of New York Buffalo New York 14260 USA.
⁵ Research and Education in Energy Environment & Water Institute, University at Buffalo, The State University of New York Buffalo New York 14260 USA.

Abstract

Advanced materials capable of withstanding extreme environments garner extensive interest in the development of next-generation advanced anti-corrosion electronics. Herein, we report that the surface passivation of printed copper conductors imparts corrosion resistance in high-temperature sulfurous environments while maintaining a high electrical conductivity of 4.42 MS m^-1 when subjected to a sulfur-containing environment at 350 °C for 12 h. This study provides potential for the development of surface-passivated copper conductors that are resistant to the sulfidizing environments found in several applications of modern technology.