Taking advantage of the large thermo-optical coefficient of polymer materials, a hybrid-integrated thermo-optic switch was designed and simulated. It is also compatible with the existing silica-based planar light-wave circuit (PLC) platform. To further reduce the power consumption, we introduced the air trench structure and optimized the structural parameters of the heating region. This scheme is beneficial to solving the problem of the large driving power of silica-based thermo-optic switches at this stage. Compared with the switching power of all-silica devices, the power consumption can be reduced from 116.11 mW (TE) and 114.86 mW (TM) to 5.49 mW (TE) and 5.96 mW (TM), which is close to the driving power of the reported switches adopting polymer material as the core. For the TE mode, the switch's rise and fall times were 121 µs and 329 µs. For the TM mode, the switch times were simulated to be 118 µs (rise) and 329 µs (fall). This device can be applied to hybrid integration fields such as array switches and reconfigurable add/drop multiplexing (ROADM) technology.
Keywords: air trench; hybrid-integrated; polymer cladding; thermo-optic switch.