The demand for high-performance and compact electronic devices has been increasing day by day. Due to their compactness, excessive heat is generated, causing a decrease in efficiency and life. Thermal management of electronic components is crucial for maintaining excessive heat within the limit. This experimental research focuses on the combined effect of nano-enhanced phase-change material (NePCM) with different configurations of heat sinks for cooling electronic devices. Multi-walled carbon nanotubes (MWCNTs) are used as nanoparticles with concentrations of 3 wt% and 6 wt%, RT-42 as the phase-change material (PCM), and aluminum as the pin fin heat sink material. Different configurations of the heat sink, such as circular, square, and triangular pin fins, are used against the fixed volume fraction of the fins. It is found that the square configuration has the highest heat transfer with and without PCM. A maximum base temperature reduction of 24.01% was observed in square pin fins with RT-42 as PCM. At 6 wt% of NePCM, the maximum base temperature lessened by 25.83% in the case of a circular pin fin. It is concluded from the results that a circular pin fin with NePCM is effective for base temperature reduction, and all fin configurations with NePCM collectively reduce the heat sink base temperature.
Keywords: electronic device; heat sink; nanoparticles; passive cooling; phase-change material.