Advanced Three-Dimensional Microelectrode Architecture Design for High-Performance On-Chip Micro-Supercapacitors

Panpan Zhang; Sheng Yang; Honggui Xie; Yang Li; Faxing Wang; Mingming Gao; Kun Guo; Renheng Wang; Xing Lu

doi:10.1021/acsnano.2c07609

Advanced Three-Dimensional Microelectrode Architecture Design for High-Performance On-Chip Micro-Supercapacitors

ACS Nano. 2022 Nov 22;16(11):17593-17612. doi: 10.1021/acsnano.2c07609. Epub 2022 Nov 11.

Authors

Panpan Zhang¹, Sheng Yang², Honggui Xie³, Yang Li⁴, Faxing Wang⁵, Mingming Gao¹, Kun Guo¹, Renheng Wang³, Xing Lu¹

Affiliations

¹ State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, 430074 Wuhan, China.
² Frontiers Science Center for Transformative Molecules, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, 200240 Shanghai, China.
³ Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Physics and Optoelectronic Engineering, Shenzhen University, 518060 Shenzhen, China.
⁴ Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126 Chemnitz, Germany.
⁵ Center for Advancing Electronics Dresden (cfaed) & Faculty of Chemistry and Food Chemistry, Technische Universität Dresden, Mommsenstrasse 4, 01069 Dresden, Germany.

PMID: 36367555
DOI: 10.1021/acsnano.2c07609

Abstract

The rapid development of miniaturized electronic devices has greatly stimulated the endless pursuit of high-performance on-chip micro-supercapacitors (MSCs) delivering both high energy and power densities. To this end, an advanced three-dimensional (3D) microelectrode architecture design offers enormous opportunities due to high mass loading of active materials, large specific surface areas, fast ion diffusion kinetics, and short electron transport pathways. In this review, we summarize the recent advances in the rational design of 3D architectured microelectrodes including 3D dense microelectrodes, 3D nanoporous microelectrodes, and 3D macroporous microelectrodes. Furthermore, the emergent microfabrication strategies are discussed in detail in terms of charge storage mechanisms and structure-performance correlation for on-chip MSCs. Finally, we conclude with a perspective on future opportunities and challenges in this thriving field.

Keywords: 3D microelectrodes; architecture design; conductive scaffold; energy density; energy storage; long-term stability; on-chip micro-supercapacitors; power density.

Publication types

Review