Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints

Po-Ning Hsu; Dai-Lung Lee; Dinh-Phuc Tran; Kai-Cheng Shie; Nien-Ti Tsou; Chih Chen

doi:10.3390/ma15207115

Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints

Materials (Basel). 2022 Oct 13;15(20):7115. doi: 10.3390/ma15207115.

Authors

Po-Ning Hsu^{1

2}, Dai-Lung Lee^{1

2}, Dinh-Phuc Tran^{1

2}, Kai-Cheng Shie^{1

2}, Nien-Ti Tsou^{1

2}, Chih Chen^{1

2}

Affiliations

¹ Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.
² Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.

Abstract

In this study, symmetrical solder joints (Cu/Ni/SnAg_2.3/Ni/Cu) were fabricated. They were electromigration (EM)-stressed at high (8 × 10⁴ A/cm²) or low (1.6 × 10⁴ A/cm²) current densities. Failures in the solder joints with different grain orientations under EM stressing were then characterized. Results show that Ni under-bump-metallurgy (UBM) was quickly dissolved into the solder joints possessing low angles between Sn c-axis and electron direction and massive NiCuSn intermetallic compounds formed in the Sn matrix. The diffusion rate of Ni increased with decreasing orientation grain angle. A theoretical model was also established to analyze the consumption rate of Ni UBM. Good agreement between the modeling and experimental results was obtained. Additionally, we found that voids were more likely to form in the solder joints under high EM stressing.

Keywords: UBM consumption; diffusion; electromigration; grain orientation.

Grants and funding

NSTC-107-2221-E-009-007-MY3, NSTC 111-2634-F-A49-008/National Science and Technology Council, Taiwan