A minimized and efficient low temperature loading device for indentation

S B Wang; O Y Wu; S R Li; Y Y Wang; H W Zhao

doi:10.1063/5.0080913

A minimized and efficient low temperature loading device for indentation

Rev Sci Instrum. 2022 Sep 1;93(9):093902. doi: 10.1063/5.0080913.

Authors

S B Wang¹, O Y Wu¹, S R Li¹, Y Y Wang¹, H W Zhao¹

Affiliation

¹ School of Mechanical and Aerospace Engineering, Jilin University, Changchun 130025, China.

PMID: 36182450
DOI: 10.1063/5.0080913

Abstract

A minimized and efficient low temperature loading device cooling with Peltier coolers for indentation test is developed. Both specimen and indentation tip are immersed in 50% methanol-water solution, totally eliminating the contact thermal drift problem. Low temperature indentation tests down to 253.8 K can be realized within 10 min. The size of the device is miniaturized within 50 × 40 × 30 mm³, and no vacuum environment is required. Monocrystalline copper is tested to perform the feasibility of the device. Based on the simple structure and stable experimental effect, the developed device can be integrated into various types of current indentation devices to attach low temperature testing ability.