Conductive metal inks with 3D-printable rheological properties have gained considerable attention, owing to their potential for manufacturing 3D electronics. Typically, such inks are formulated with high volume fractions of metal particles to achieve both rheological and electrical percolation. However, this leads to a high product cost and weight, making this approach potentially undesirable for practical application. In this study, naturally occurring ingredients, i.e., bee pollen microparticles (BPMPs) and citric acids (CAs), are used to produce a jammed hexane-in-aqueous suspension-type emulsion with controllable viscoelasticity as a template for conductive metal particles. Correspondingly, it is possible to develop 3D-printable, lightweight, and conductive inks. The BPMPs and CAs, as rheology modifiers, facilitate the 3D printability of the ink. After drying, the ink forms 3D networks without macroscopic discontinuities. Hexanes co-dispersed with BPMPs and CAs in the aqueous continuous phase improve the ink rheological processability and create internal macropores within the 3D-printed structure upon evaporation under ambient conditions, decreasing the product density. A conductive copper ink based on the emulsion template shows excellent 3D printability and electrical percolation at low metal loadings (<10 vol%); moreover, the printed ink with the optimized formulation has a remarkably low density (<2 g ∙ cm-3).
Keywords: 3D printing; Bee pollen microparticle; Colloidal ink; Conductive metal ink; Emulsion.
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