Analysis of Microstrip Line with Asymmetric Arch Type Cross-Sectional Structure Using Micro Pattern Transfer Printing Method

Seungmin Woo; Jaehyeok Choi; Kwangjong Choi; Bokyeong Kang; Hwasun Park; Youngoo Yang

doi:10.3390/s22155613

Analysis of Microstrip Line with Asymmetric Arch Type Cross-Sectional Structure Using Micro Pattern Transfer Printing Method

Sensors (Basel). 2022 Jul 27;22(15):5613. doi: 10.3390/s22155613.

Authors

Seungmin Woo¹, Jaehyeok Choi¹, Kwangjong Choi², Bokyeong Kang², Hwasun Park³, Youngoo Yang^{1

4}

Affiliations

¹ Department of Electrical and Computer Engineering, Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Suwon 16419, Korea.
² Samwon ACT Inc., 67 Sandan-ro, Danwon-gu, Ansan 15599, Korea.
³ Department of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Suwon 16419, Korea.
⁴ Para-PA Inc., 2066 Seobu-ro, Jangan-gu, Suwon 16419, Korea.

Abstract

This paper presents the manufacturing procedure and electrical properties of a microstrip line on flexible printed circuit boards (FPCBs) fabricated using the micro pattern transfer printing (MPTP) method for millimeter wave band application. The MPTP method presented herein is compared to the conventional FPCB process based on the degree of insertion loss as it pertains to the cross-sectional shape of the formed microstrip line. Electromagnetic field simulations were performed to confirm that the cross-sectional arch shape fabricated by the MPTP process reduces insertion loss in the high-frequency band. Based on the simulation, the microstrip transmission line was optimized to a width of 217 µm and a length of 30 cm, fabricated on a 50 µm thick poly-cyclohexylene dimethylene terephthalate (PCT) substrate to measure the insertion loss. The insertion loss fabricated using the MPTP method is measured as 0.37 dB/cm at 10 GHz, while the conventional FPCB is measured as 0.66 dB/cm. Through the analysis, it was confirmed that the FPCBs manufactured by the MPTP process show lower insertion loss compared to the conventional FPCBs.

Keywords: arch type cross-section; flexible printed circuit board; low loss transmission line; micro pattern transfer printing method.

Grants and funding

This work was supported by the Technology Innovation Program (or Industrial Strategic Technology Development Program—Next-generation hybrid PCB technology development) 20010707, “Development of Low Loss Hybrid FPCB Production Technology for 5 Gbps Communication Signal Transmission in Smart Cars funded By the Ministry of Trade, Industry and Energy (MOTIE, Korea)”.