Tetrafluorophenylene-Containing Vinylbenzyl Ether-Terminated Oligo(2,6-dimethyl-1,4-phenylene ether) with Better Thermal, Dielectric, and Flame-Retardant Properties for Application in High-Frequency Communication

Yi-Chun Chen; Kamani Sudhir K Reddy; Yu-An Lin; Meng-Wei Wang; Ching-Hsuan Lin

doi:10.1021/acsomega.2c02067

Tetrafluorophenylene-Containing Vinylbenzyl Ether-Terminated Oligo(2,6-dimethyl-1,4-phenylene ether) with Better Thermal, Dielectric, and Flame-Retardant Properties for Application in High-Frequency Communication

ACS Omega. 2022 Jul 22;7(30):26396-26406. doi: 10.1021/acsomega.2c02067. eCollection 2022 Aug 2.

Authors

Yi-Chun Chen¹, Kamani Sudhir K Reddy², Yu-An Lin², Meng-Wei Wang³, Ching-Hsuan Lin²

Affiliations

¹ Advanced Research Center for Green Materials Science and Technology, National Taiwan University, 106, No. 1, Section 4, Roosevelt Road, Room 219, School of Engineering Complex, Taipei 10617, Taiwan.
² Department of Chemical Engineering, National Chung Hsing University, No. 145, Xingda Road, South District, Taichung 40227, Taiwan.
³ Advanced Material Development Department, Swancor High polymer Company Limited by Shares, Nantou 54066, Taiwan.

Abstract

In an integrated circuit, signal propagation loss is proportional to the frequency, dissipation factor (D _f), and square root of dielectric constant (D _k). The loss becomes obvious as we move to high-frequency communication. Therefore, a polymer having low D _k and D _f is critical for copper-clad laminates at higher frequencies. For this purpose, a 4-vinylbenzyl ether phenoxy-2,3,5,6-tetrafluorophenylene-terminated OPE (VT-OPE) resin was synthesized and its properties were compared with the thermoset of commercial OPE-2St resin. The thermoset of VT-OPE shows a higher T _g (242 vs 229 °C), a relatively high cross-linking density (1.59 vs 1.41 mmole cm^-3), a lower coefficient of thermal expansion (55 vs 76 ppm/°C), better dielectric characteristic at 10 GHz (D _k values of 2.58 vs 2.75, D _f values of 0.005 vs 0.006), lower water absorption (0.135 vs 0.312 wt %), and better flame retardancy (UL-94 VTM-0 vs VTM-1 with dropping seriously) than the thermoset of OPE-2St. To verify the practicability of VT-OPE for copper-clad laminate, a laboratory process was also performed to prepare a copper-clad laminate, which shows a high peeling strength with copper foil (5.5 lb/in), high thermal reliability with a solder dipping test at 288 °C (>600 s), and the time for delamination of the laminate in thermal mechanical analysis (TMA) at 288 °C is over 60 min.