Fascinating pattern formation by quasi-static crack growth in thin films has received increasing interest in both interdisciplinary science and engineering applications. The paper mainly reviews recent experimental and theoretical progress on the morphogenesis and propagation of various quasi-static crack patterns in thin films. Several key factors due to changes in loading types and substrate confinement for choosing crack paths toward different patterns are summarized. Moreover, the effect of crack propagation coupled to other competing or coexisting stress-relaxation processes in thin films, such as interface debonding/delamination and buckling instability, on the formation and transition of crack patterns is discussed. Discussions on the sources and changes in the driving force that determine crack pattern evolution may provide guidelines for the reliability and failure mechanism of thin film structures by cracking and for controllable fabrication of various crack patterns in thin films.